Organic light-emitting display apparatus

ABSTRACT

An organic light-emitting display apparatus includes: a substrate; a display unit on the substrate and including a display area and a non-display area outside of the display area; and a thin-film encapsulation layer that seals the display unit, wherein the non-display area includes a dam region located outside of the display area and a plurality of protrusions on at least a part of the display unit outside of the dam region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/442,387, filed on Jun. 14, 2019, which is a continuation of U.S.patent application Ser. No. 15/973,402, filed May 7, 2018, now U.S. Pat.No. 10,326,099, which is a continuation of U.S. patent application Ser.No. 15/628,557, filed Jun. 20, 2017, now U.S. Pat. No. 9,966,558, whichis a continuation of U.S. patent application Ser. No. 14/884,610, filedOct. 15, 2015, now U.S. Pat. No. 9,685,626, which claims priority to andthe benefit of Korean Patent Application No. 10-2015-0043297, filed Mar.27, 2015, the entire content of all of which is incorporated herein byreference.

BACKGROUND 1. Field

One or more example embodiments relate to an organic light-emittingdisplay apparatus.

2. Description of the Related Art

An organic light-emitting display apparatus includes an organiclight-emitting device including a hole injection electrode, an electroninjection electrode, and an organic emission layer disposedtherebetween, and is a self-emission type (or kind of) display apparatusin which holes injected from the hole injection electrode and electronsinjected from the electron injection electrode combine in the organicemission layer to generate excitons that change from an excited state toa ground state to emit light.

Since the organic light-emitting display apparatus that is aself-emission display apparatus does not use a separate light source,the organic light-emitting display apparatus may be driven at a lowvoltage, may be light-weight, and may be thin. Furthermore, the organiclight-emitting display apparatus is receiving attention as a nextgeneration display apparatus owing to its high quality characteristics,such as a wide viewing angle, high contrast, and a quick response speed.However, since an organic light-emitting device is deteriorated due topenetration of external moisture or oxygen into the organiclight-emitting device, external moisture or oxygen need to be blockedfrom penetrating into the organic light-emitting device.

SUMMARY

One or more example embodiments include an organic light-emittingdisplay apparatus.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more example embodiments, an organic light-emittingdisplay apparatus includes: a substrate; a display unit on the substrateand including a display area and a non-display area outside of thedisplay area; and a thin-film encapsulation layer that seals the displayunit, wherein the non-display area includes a dam region located outsideof the display area and a plurality of protrusions on at least a part ofthe display unit outside of the dam region.

The plurality of protrusions may form a uniform pattern.

The plurality of protrusions may be arranged in a plurality of rows anda plurality of columns.

The plurality of protrusions may surround the dam region.

A power supply wire may be located in the non-display area, and the damregion may overlap and contact at least an outer edge of the powersupply wire.

The thin-film encapsulation layer may include at least one inorganicfilm and at least one organic film, wherein the at least one organicfilm may be located in the dam region.

The thin-film encapsulation layer may include a plurality of inorganicfilms and a plurality of organic films respectively located between theplurality of inorganic films, wherein the plurality of inorganic filmsmay cover the plurality of protrusions.

The plurality of inorganic films may contact each other outside of theplurality of protrusions.

The display unit may include: a thin-film transistor; an organiclight-emitting device electrically coupled to the thin-film transistor;a passivation film between the thin-film transistor and the organiclight-emitting device; and a pixel defining film defining a pixel regionof the organic light-emitting device, wherein the dam region and theplurality of protrusions may be formed of a same material as at leastone selected from the passivation film and the pixel-defining film.

The dam region may include: a first layer formed of a same material asthe passivation film; and a second layer on the first layer and formedof a same material as the pixel-defining film, and the plurality ofprotrusions may be formed of the same material as the pixel-definingfilm.

The thin-film transistor may include: an active layer; a gate electrode;a source electrode; and a drain electrode, wherein a gate insulatinglayer may be located between the active layer and the gate electrode,and an interlayer insulating film may be located between the gateelectrode and the source and drain electrodes, and the gate insulatinglayer and the interlayer insulating film may extend to the non-displayarea.

The plurality of protrusions may be located on the interlayer insulatingfilm.

The thin-film encapsulation layer may include at least one inorganicfilm, wherein the at least one inorganic film may contact the interlayerinsulating film outside of the plurality of protrusions.

The at least one inorganic film may contact a top surface of thesubstrate through an edge portion of the interlayer insulating film.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the example embodiments,taken in conjunction with the accompanying drawings in which:

FIG. 1 is a plan view schematically illustrating an organiclight-emitting display apparatus according to an example embodiment;

FIG. 2 is a cross-sectional view taken along a line I-I′ of FIG. 1;

FIG. 3 is an enlarged view of a region A of FIG. 1; and

FIGS. 4 and 5 are cross-sectional views taken along a line II-II′ ofFIG. 3.

DETAILED DESCRIPTION

Reference will now be made in more detail to example embodiments,examples of which are illustrated in the accompanying drawings. In thisregard, the present example embodiments may have different forms andshould not be construed as being limited to the descriptions set forthherein. Accordingly, the example embodiments are merely described below,by referring to the figures, to explain aspects of embodiments of thepresent description. Also, while describing one or more exampleembodiments, detailed descriptions about related well-known functions orconfigurations that may diminish the clarity of the points of the one ormore example embodiments are omitted.

It will be understood that although the terms “first”, “second”, etc.may be used herein to describe various components, these componentsshould not be limited by these terms. These terms are only used todistinguish one component from another component.

Terms used herein are only used to describe one or more exampleembodiments, and are not intended to limit the one or more exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. Sizes of elements in the drawings may beexaggerated for convenience of explanation. In other words, since sizesand thicknesses of components in the drawings may be arbitrarilyillustrated for convenience of explanation, the following embodimentsare not limited thereto.

It will be understood that when a layer, region, or component isreferred to as being “formed on,” “formed under,” “coupled to,” or“connected to” another layer, region, or component, it can be directlyor indirectly formed on, formed under, coupled to, or connected to,respectively, the other layer, region, or component. That is, forexample, intervening layers, regions, or components may be present.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items. Expressions such as “atleast one of”, when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

Hereinafter, one or more example embodiments will be described below inmore detail with reference to the accompanying drawings. Thosecomponents that are the same or that are in correspondence with oneanother are rendered or identified using the same reference numeralregardless of the figure number, and redundant explanations thereof arenot provided.

FIG. 1 is a plan view schematically illustrating an organiclight-emitting display apparatus 10 according to an example embodiment,FIG. 2 is a cross-sectional view taken along a line I-I′ of FIG. 1, FIG.3 is an enlarged view of a region A of FIG. 1, and FIGS. 4 and 5 arecross-sectional views taken along a line II-II′ of FIG. 3.

Referring to FIGS. 1 through 5, the organic light-emitting displayapparatus 10 according to an example embodiment may include a substrate101, a display unit 100 disposed on the substrate 101, and a thin-filmencapsulation layer 300 sealing the display unit 100.

The substrate 101 may be formed of any one of various suitablematerials. For example, the substrate 101 may be formed of a transparentglass material mainly including silicon oxide (e.g., SiO₂). However, amaterial of the substrate 101 is not limited thereto, and the substrate101 may be formed of a transparent plastic material to be more flexible.The transparent plastic material may include an insulating organicmaterial, such as polyethersulphone (PES), polyacrylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN),polyethyleneterephthalate (PET), polyphenylene sulfide (PPS),polyarylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC),or cellulose acetate propionate (CAP).

When the organic light-emitting display apparatus 10 is abottom-emission type (or kind) wherein an image is realized in adirection toward the substrate 101, the substrate 101 is formed of atransparent material. However, when the organic light-emitting displayapparatus 10 is a top-emission type (or kind) wherein an image isrealized in a direction opposite to the substrate 101 (e.g., a directionaway from the substrate 101), the substrate 101 may not necessarily beformed of a transparent material. In this case, the substrate 101 may beformed of, for example, a metal.

When the substrate 101 is formed of a metal, the substrate 101 mayinclude at least one selected from iron, chromium, manganese, nickel,titanium, molybdenum, stainless steel (SUS), invar alloy, inconel alloy,and kovar alloy, but the substrate is not limited thereto.

The display unit 100 may be formed on the substrate 101. The displayunit 100 may include a display area DA for realizing an imagerecognizable (viewable) by a user, and a non-display area outside of thedisplay area DA. An organic light-emitting device 100 b (shown in FIG.2) may be disposed in the display area DA, and a power supply wire 220supplying power to the organic light-emitting device 100 b may bedisposed in the non-display area. Also, a pad unit 150 transmitting anelectric signal from a power supply device or a signal generating deviceto the display area DA may be disposed in the non-display area. Thedisplay unit 100 will now be described in more detail with reference toFIG. 2.

A buffer layer 102 may be formed on the substrate 101. The buffer layer102 may provide a flat surface on the substrate 101, and prevent orreduce an impurity or moisture from penetrating through the substrate101.

For example, the buffer layer 102 may contain or include an inorganicmaterial, such as silicon oxide, silicon nitride, silicon oxynitride,aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride;or an organic material, such as polyimide, polyester, or acryl; or mayinclude a plurality of layers formed of or including the above-mentionedmaterials. The buffer layer 102 may be formed on the display area DA,and may extend to the non-display area.

A thin-film transistor 100 a and the organic light-emitting device 100 belectrically coupled or connected to the thin-film transistor 100 a maybe located in the display area DA.

The thin-film transistor 100 a may include an active layer 103, a gateelectrode 105, a source electrode 107, and a drain electrode 108.

Hereinafter, it is assumed that the thin-film transistor 100 a is a topgate type (or kind) wherein the active layer 103, the gate electrode105, the source electrode 107, and the drain electrode 108 aresequentially formed in the stated order. However, the present disclosureis not limited thereto, and the thin-film transistor 100 a may be anysuitable type (or kind), such as a bottom gate type (or kind).

In some embodiments, the active layer 103 is formed on the buffer layer102. The active layer 103 may include a semiconductor material, such asamorphous silicon or polycrystalline silicon. However, the presentdisclosure is not limited thereto, and the active layer 103 may includeany one of various suitable materials. According to an exampleembodiment, the active layer 103 may include an organic semiconductormaterial.

According to another example embodiment, the active layer 103 mayinclude an oxide semiconductor material. For example, the active layer103 may include an oxide of a material selected from among 12-, 13-, and14-group metal elements (e.g., group 12, 13, and 14 metal elements ofthe periodic table of elements), such as, for example, selected fromzinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), andgermanium (Ge), and a combination thereof.

A gate insulating layer 104 is formed on the active layer 103. The gateinsulating layer 104 may include a single film or a plurality of filmsformed of an inorganic material, such as silicon oxide and/or siliconnitride.

The gate insulating layer 104 insulates the active layer 103 and thegate electrode 105 from each other. The gate insulating layer 104 may beformed or located not only in the display area DA, but may also beformed or located in a part of the non-display area.

The gate electrode 105 is formed on the gate insulating layer 104. Thegate electrode 105 may be coupled or connected to a gate line thatapplies an on/off signal to the thin-film transistor 100 a.

The gate electrode 105 may be formed of a low-resistance metal material.The gate electrode 105 may include a single layer or multiple layers (aplurality of layers) formed of, for example, at least one selected fromaluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium(Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr), lithium (Le), calcium (Ca), molybdenum (Mo), titanium (Ti),tungsten (W), and copper (Cu), considering adhesion of the gateelectrode 105 to an adjacent layer, surface flatness of a stacked layerincluding the gate electrode 105, and processability.

An interlayer insulating film 106 is formed on the gate electrode 105.The interlayer insulating film 106 insulates the gate electrode 105 fromthe source and gate electrodes 107 and 108. The interlayer insulatingfilm 106 may be formed or located not only in the display area DA, butmay also be formed or located in a part of the non-display area.

The interlayer insulating film 106 may include a single film or multipleof films (a plurality of films) formed of inorganic material. Forexample, the inorganic material may be metal oxide or metal nitride. Inmore detail, examples of the inorganic material include silicon oxide(SiO₂), silicon nitride (SiNx; 1/2≤x≤4/3), silicon oxynitride (SiON),aluminum oxide (Al₂O₃), titanium oxide (TiO₂), tantalum oxide (Ta₂O₅),hafnium oxide (HfO₂), and zinc oxide (ZrO₂).

The source and drain electrodes 107 and 108 are formed on the interlayerinsulating film 106. The source and drain electrodes 107 and 108 mayeach include a single layer or a multilayer (a plurality of layers)formed of at least one material selected from among Al, Pt, Pd, Ag, Mg,Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and Cu. The source and drainelectrodes 107 and 108 are formed to contact (directly contact) a regionof the active layer 103.

A passivation film 109 may be formed to cover the thin-film transistor100 a. The passivation film 109 removes a stepped portion formed by thethin-film transistor 100 a and flattens a top surface of the thin-filmtransistor 100 a (a top surface above the thin-film transistor 100 a),thereby preventing or reducing a defect in the organic light-emittingdevice 100 b caused by a lower unevenness (e.g., an unevenness due tothe thin-film transistor 100 a).

The passivation film 109 may include a single film or a plurality offilms formed of an organic material. Examples of the organic materialinclude polymethyl methacrylate (PMMA), general-purpose polymer such aspolystyrene (PS), polymer derivatives having a phenol-based group,acryl-based polymer, imide-based polymer, aryl ether-based polymer,amide-based polymer, fluorine-based polymer, p-xylene-based polymer,vinyl alcohol-based polymer, and a blend thereof (e.g., a blend of anyof the foregoing polymers). In some embodiments, the passivation film109 may be a complex stacked structure of an inorganic insulating filmand an organic insulating film.

The organic light-emitting device 100 b is formed on the passivationfilm 109. The organic light-emitting device 100 b is electricallycoupled or connected to the thin-film transistor 100 a, and includes afirst electrode 110, a second electrode 113 facing the first electrode110, and an intermediate layer 112 disposed between the first electrode110 and the second electrode 113.

The first electrode 110 may be electrically coupled or connected to thegate electrode 108. The first electrode 110 may have any one of varioussuitable shapes. For example, the first electrode 110 may be patternedin island shapes (e.g., the first electrode may include a plurality ofdistinct islands that do not directly contact one another).

The first electrode 110 is formed on the passivation film 109, and maybe electrically coupled or connected to the thin-film transistor 100 athrough a contact hole formed on the passivation film 109 (e.g., acontact hole passing through the passivation film 109). The firstelectrode 110 may be, for example, a reflective electrode. For example,the first electrode 110 may include a reflective film formed of Ag, Mg,Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparentor semi-transparent electrode layer formed on the reflective film. Thetransparent or semi-transparent electrode layer may be formed of amaterial selected from indium tin oxide (ITO), indium zinc oxide (IZO),zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide (IGO), andaluminum zinc oxide (AZO).

The second electrode 113 facing the first electrode 110 may be atransparent or semi-transparent electrode, and may include a thin filmformed of a metal having a low work function, such as Li, Ca, LiF/Ca,LiF/AI, Al, Ag, Mg, or a compound or a combination thereof. Also, anauxiliary electrode layer or a bus electrode may be further formed onthe thin film by using a transparent electrode forming material, such asITO, IZO, ZnO, or In₂O₃. Accordingly, the second electrode 113 maytransmit light emitted from an organic emission layer included in theintermediate layer 112. For example, light emitted from the organicemission layer may be transmitted to the second electrode 113 directlyor after being reflected at the first electrode 110, which may be areflective electrode.

However, a type (or kind) of the display unit 100 according to exampleembodiments is not limited to a top emission type (or kind), and may bea bottom emission type (or kind) wherein light emitted from the organicemission layer is emitted towards the substrate 101. In this case, thefirst electrode 110 may be a transparent or semi-transparent electrode,and the second electrode 113 may be a reflective electrode. In someembodiments, the display unit 100 according to an example embodiment maybe a dual emission type (or kind) wherein light is emitted in both topand bottom directions.

Meanwhile, a pixel-defining film 119 is formed on the first electrode110 by using an insulating material. The pixel-defining film 119 may beformed of at least one organic insulating material selected frompolyimide, polyamide, acryl resin, benzocyclobutene, and phenol resin,via a spin coating method. The pixel-defining film 119 exposes a certainregion of the first electrode 110. The intermediate layer 112 includingthe organic emission layer is disposed in the certain region (e.g., inthe exposed portion). In other words, the pixel-defining film 119defines a pixel region of the organic light-emitting device 100 b.

The organic emission layer included in the intermediate layer 112 may beformed of a low molecular organic material or a high molecular organicmaterial (e.g., a low molecular weight organic material or a highmolecular weight organic material), and the intermediate layer 112 mayfurther include a functional layer, such as a hole transport layer(HTL), a hole injection layer (HIL), an electron transport layer (ETL),or an electron injection layer (EIL), as well as the organic emissionlayer.

A dam region 120 and a plurality of protrusions 130 may be located inthe non-display area outside of the display area DA. In addition, thenon-display area may include various suitable circuit patterns, such asthe power supply wire 220 and a static electricity preventing pattern(e.g., a pattern that prevents or reduces generation of staticelectricity).

The power supply wire 220 includes a common voltage line ELVSS and adriving voltage line ELVDD, and may be formed of a same (substantiallythe same) material as the source and drain electrodes 107 and 108. InFIG. 2, the common voltage line ELVSS of the power supply wire 220 isillustrated, and the common voltage line ELVSS and the second electrode113 are coupled or connected to each other through a wire 116, but thepresent disclosure is not limited thereto. For example, the commonvoltage line ELVSS and the second electrode 113 may be directly coupledor connected to each other.

The dam region 120 is disposed outside of the display area DA to preventor reduce organic materials for forming organic films 310 and 330 of thethin-film encapsulation layer 300 from flowing towards an edge of thesubstrate 101 while forming the organic films 310 and 330, therebypreventing or reducing an edge tail of the organic films 310 and 330from being formed. The dam region 120 may be formed to surround(partially or completely surround) the display area DA.

The dam region 120 may be formed of a same (substantially the same)material as at least one selected from the passivation film 109 and thepixel-defining film 119. For example, the dam region 120 may include afirst layer 121 formed of the same (substantially the same) material asthe passivation film 109, and a second layer 122 formed on the firstlayer 121 and formed of the same (substantially the same) material asthe pixel-defining film 119. However, the present disclosure is notlimited thereto, and the dam region 120 may include one layer (e.g., thedam region 120 may include a sole layer). Also, there may be a pluralityof the dam regions 120. In this case, heights of the dam regions 120 mayincrease towards the outside of the substrate 101 (e.g., a height of adam closer to an edge of the substrate 101 may be larger than a heightof a dam further from the edge of the substrate 101).

The dam region 120 may overlap and contact (directly contact) at least apart of the power supply wire 220. For example, the dam region 120 mayoverlap and contact (directly contact) at least an outer edge of thepower supply wire 220. The dam region 120 formed of the same(substantially the same) material as at least one selected from thepassivation film 109 and the pixel-defining film 119 may have excellentbonding power (adhesion) to a metal. Accordingly, when the dam region120 contacts the power supply wire 220 formed of a metal material, thedam region 120 may be stably formed with excellent bonding power(adhesion).

For example, in FIG. 2, the dam region 120 overlaps the outer edge ofthe power supply wire 220, but the present disclosure is not limitedthereto. In some embodiments, the dam region 120 may be formed only onthe power supply wire 220 or to cover the power supply wire 220.

The plurality of protrusions 130 may be formed on at least a partoutside of the dam region 120. The protrusions 130 are located on theinterlayer insulating film 106, and may be formed of the same(substantially the same) material as at least one selected from thepassivation film 109 and the pixel-defining film 119.

The protrusions 130 may have a height lower than that of the dam region120. For example, when the dam region 120 includes the first layer 121formed of the same (substantially the same) material as the passivationfilm 109 and the second layer 122 formed on the first layer 121 andformed of the same (substantially the same) material as thepixel-defining film 119, the protrusions 130 may be formed of the same(substantially the same) material as the pixel-defining film 119.

The protrusions 130 may have a uniform (substantially uniform) patternoutside of the dam region 120. The protrusions 130 may be spaced apartfrom each other at regular (substantially regular) intervals. Forexample, the protrusions 130 may be disposed in a plurality of rows anda plurality of columns. The number of rows and columns of theprotrusions 130 are not limited. However, as will be described below,the number of columns of the protrusions 130 may be at least three so asto recognize a pattern change of reflection light L2 reflected by theprotrusions 130 (e.g., so that a change in a pattern of light L2reflected by the protrusions 130 may be detected). The protrusions 130may have any one of various suitable shapes, such as a pillar shapeand/or a horn shape.

The protrusions 130 are used to easily recognize the organic materialfor forming the organic films 310 and 330 flowing outside of thesubstrate 101 over the dam region 120 (e.g., flow of the organicmaterial for forming the organic films 310 and 330 over the dam region120 may be detected by way of the protrusions 130). When the organicmaterial for forming the organic films 310 and 330 flows outside of thesubstrate 101 over the dam region 120, edge tails of the organic films310 and 330 may be formed. In this case, external moisture or oxygen maypenetrate into the organic light-emitting display apparatus 10 throughthe edge tails, thereby causing a defect, such as a dark spot, in theorganic light-emitting display apparatus 10.

FIGS. 4 and 5 are cross-sectional views taken along a line II-II′ ofFIG. 3, wherein in FIG. 4, an organic material M for forming the organicfilms 310 and 330 only exists on an inner region of the dam region 120and in FIG. 5, the organic material M flows outside of the substrate 101over the dam region 120.

As shown in FIG. 4, when flow of the organic material M is blocked bythe dam region 120, shapes of the protrusions 130 outside of the damregion 120 remain intact (e.g., the position and/or shape of each of theprotrusions 130 has not been changed or altered by the flow of theorganic material). Accordingly, when light L1 is irradiated on or to theprotrusions 130 from an external light source LS, the reflection lightL2 reflected at the protrusions 130 having a uniform (substantiallyuniform) pattern may also have a uniform (substantially uniform)pattern.

However, as shown in FIG. 5, when the organic material M flows outsideof the substrate 101 over the dam region 120, the shapes (and/orpositions) of the protrusions 130 may be changed by the organic materialM. For example, some of the protrusions 130 may be tilted or may fall ina direction towards the outside of the substrate 101 by the organicmaterial M. When the shapes of the protrusions 130 are changed as suchand the light L1 is irradiated from the light source LS, a reflectionpattern of the reflection light L2 is changed by the protrusions 130.Thus, overflow of the organic material M may be easily identified(detected).

The protrusions 130 may be formed throughout and around the dam region120. When the protrusions 130 are disposed to surround (partially orcompletely surround) the dam region 120, the overflow of the organicmaterial M may be easily and quickly detected throughout and around thedam regions 120. In other words, since a defect may be easily determinedwhile manufacturing the organic light-emitting display apparatus 10, ayield of the organic light-emitting display apparatus 10 may beincreased.

Also, in some embodiments, the protrusions 130 have a concave-convexstructure, and a first inorganic film 320 and a second inorganic film340 of the thin-film encapsulation layer 300 may be formed to cover theprotrusions 130 as will be described below. Accordingly, a penetrationlength of external moisture and oxygen may be increased.

The thin-film encapsulation layer 300 may seal the display unit 100 toprevent or reduce external oxygen and moisture from penetrating into thedisplay unit 100. The thin-film encapsulation layer 300 may include theorganic films 310 and 330 and the first and second inorganic films 320and 340.

The organic films 310 and 330 and the first and second inorganic films320 and 340 may be alternately stacked on each other to form amultilayer structure. In FIG. 2, the thin-film encapsulation layer 300includes two organic films 310 and 330 and two first and secondinorganic films 320 and 340, but the present disclosure is not limitedthereto. For example, the thin-film encapsulation layer 300 may furtherinclude a plurality of inorganic encapsulation films and a plurality oforganic encapsulation films, which are alternately disposed, wherein anumber of times the inorganic encapsulation films and the organicencapsulation films are stacked on each other is not limited.

The organic films 310 and 330 may include at least one material selectedfrom acryl-based resin, methacryl-based resin, polyisoprene, vinyl-basedresin, epoxy-based resin, urethane-based resin, cellulose-based resin,and perylene-based resin.

Meanwhile, since the dam region 120 prevents or reduces the organicmaterial M from flowing towards the edge of the substrate 101 whileforming the organic films 310 and 330, the organic films 310 and 330 arelocated in (inside) the dam region 120.

The first and second inorganic films 320 and 340 may include at leastone material selected from silicon nitride, aluminum nitride, zirconiumnitride, titanium nitride, hafnium nitride, tantalum nitride, siliconoxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, andsilicon oxynitride.

The first and second inorganic films 320 and 340 are formed to be largerthan the organic films 310 and 330 and to cover the dam region 120 andthe protrusions 130 that are concave and convex. Accordingly, apenetration length of external moisture and oxygen may be increased,thereby delaying, blocking, or reducing penetration of the externalmoisture and oxygen.

The first and second inorganic films 320 and 340 may extend outside ofthe protrusions 130, and may contact (directly contact) each otheroutside of the protrusions 130 (e.g., at least one of the first andsecond inorganic films 320 and 340 may directly contact at least oneother of the first and second inorganic films 320 and 340 in a regionoutside of the protrusions 130). Also, at least one selected from thefirst and second inorganic films 320 and 340 may contact (directlycontact) the interlayer insulating film 106 outside of the protrusions130. Accordingly, bonding power (adhesion) of the thin-filmencapsulation layer 300 may be increased and external moisture may beprevented or reduced from being permeated.

Also, at least one selected from the first and second inorganic films320 and 340 may contact (directly contact) a top surface of thesubstrate 10 through an edge portion of the interlayer insulating film106 outside of the protrusions 130, and may also contact (directlycontact) side surfaces of the gate insulating layer 104 and interlayerinsulating film 106. Accordingly, an encapsulation characteristic of thethin-film encapsulation layer 300 may be prevented or reduced from beingweakened or removed due to detachment of edges of the first and secondinorganic films 320 and 340.

According to an organic light-emitting display apparatus according to anexample embodiment, penetration of external moisture or oxygen may beblocked or reduced by preventing or reducing an edge tail of an organicfilm of a thin-film encapsulation layer from being formed, and overflowof an organic material for forming an organic film may be easilydetermined.

While one or more example embodiments have been described with referenceto the figures, it will be understood by those of ordinary skill in theart that various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims,and equivalents thereof.

What is claimed is:
 1. An organic light-emitting display apparatuscomprising: a substrate; a plurality of organic light-emitting devicesover the substrate; a thin-film encapsulation layer over the pluralityof organic light-emitting devices; a power supply wire over thesubstrate, wherein the power supply wire, on plan view, is locatedoutside of the plurality of organic light-emitting devices; aprotrusion, on plan view, located outside of the plurality of organiclight-emitting devices; and a concave and convex portion, on plan view,located outside of the protrusion, wherein the protrusion overlaps andcontacts at least an outer edge of the power supply wire.
 2. The organiclight-emitting display apparatus of claim 1, wherein the concave andconvex portion comprises a plurality of concave portions spaced apartfrom each other at regular intervals.
 3. The organic light-emittingdisplay apparatus of claim 1, wherein the concave and convex portionsurrounds the plurality of organic light-emitting devices.
 4. Theorganic light-emitting display apparatus of claim 1, further comprisingthin-film transistors electrically coupled to the plurality of organiclight-emitting devices, and wherein the power supply wire and theplurality of organic light-emitting devices are electrically coupled toeach other through a wire.
 5. The organic light-emitting displayapparatus of claim 4, wherein the thin-film encapsulation layercomprises: a first inorganic film; a first organic film on the firstinorganic film; and a second inorganic film on the first organic film,and wherein a portion of the wire directly contacts the first inorganicfilm.
 6. The organic light-emitting display apparatus of claim 4,further comprising a passivation film between the thin-film transistorsand the plurality of organic light-emitting devices; and apixel-defining film defining pixel regions of the plurality organiclight-emitting devices, wherein the protrusion comprises a same materialas at least one selected from the passivation film and thepixel-defining film.
 7. The organic light-emitting display apparatus ofclaim 6, wherein the protrusion comprises: a first layer comprising asame material as the passivation film; and a second layer on the firstlayer comprising a same material as the pixel-defining film.
 8. Theorganic light-emitting display apparatus of claim 6, wherein each of thethin-film transistors comprises: an active layer; a gate electrode; asource electrode; and a drain electrode, wherein a gate insulating layeris located between the active layer and the gate electrode, aninterlayer insulating film is located between the gate electrode and thesource and drain electrodes, and the gate insulating layer and theinterlayer insulating film extend outside of the protrusion.
 9. Theorganic light-emitting display apparatus of claim 8, wherein thethin-film encapsulation layer comprises at least one inorganic film,wherein the at least one inorganic film contacts the interlayerinsulating film outside of the protrusion.
 10. An organic light-emittingdisplay apparatus comprising: a substrate; a display unit on thesubstrate and comprising a display area and a non-display area outsideof the display area; and a thin-film encapsulation layer over thedisplay unit, wherein the non-display area comprises a protrusionlocated outside of the display area, and wherein a power supply wire islocated in the non-display area, and the protrusion covers a portion oftop surface and outer side surface of the power supply wire.
 11. Theorganic light-emitting display apparatus of claim 10, wherein thedisplay unit comprises a thin-film transistor and an organiclight-emitting device electrically coupled to the thin-film transistor;and wherein the power supply wire and the organic light-emitting deviceare electrically coupled to each other through a wire.
 12. The organiclight-emitting display apparatus of claim 11, wherein the thin-filmencapsulation layer comprises: a first inorganic film; a first organicfilm on the first inorganic film; and a second inorganic film on thefirst organic film, and wherein a portion of the wire directly contactsthe first inorganic film.
 13. The organic light-emitting displayapparatus of claim 10, wherein the display unit comprises: a thin-filmtransistor; an organic light-emitting device electrically coupled to thethin-film transistor; a passivation film between the thin-filmtransistor and the organic light-emitting device; and a pixel-definingfilm defining a pixel region of the organic light-emitting device,wherein the protrusion comprises a same material as at least oneselected from the passivation film and the pixel-defining film.
 14. Theorganic light-emitting display apparatus of claim 13, wherein theprotrusion comprises: a first layer comprising a same material as thepassivation film; and a second layer on the first layer and comprising asame material as the pixel-defining film.
 15. The organic light-emittingdisplay apparatus of claim 11, wherein the thin-film transistorcomprises: an active layer; a gate electrode; a source electrode; and adrain electrode, wherein a gate insulating layer is located between theactive layer and the gate electrode, and an interlayer insulating filmis located between the gate electrode and the source and drainelectrodes, and the gate insulating layer and the interlayer insulatingfilm extend to the non-display area.
 16. The organic light-emittingdisplay apparatus of claim 15, wherein the thin-film encapsulation layercomprises at least one inorganic film, and wherein the at least oneinorganic film contacts the interlayer insulating film outside of theprotrusion.
 17. The organic light-emitting display apparatus of claim10, wherein the thin-film encapsulation layer comprises: a firstinorganic film; a first organic film on the first inorganic film; and asecond inorganic film on the first organic film, and wherein the firstinorganic film and the second inorganic film contact each other outsideof the protrusion.
 18. An organic light-emitting display apparatuscomprising: a substrate; a plurality of organic light-emitting devicesover the substrate; a thin-film encapsulation layer over the pluralityof organic light-emitting devices; a power supply wire over thesubstrate, wherein the power supply wire, on plan view, is locatedoutside of the plurality of organic light-emitting devices; and aprotrusion, on plan view, located outside of the plurality of organiclight-emitting devices, wherein the protrusion overlaps and contacts atleast an outer edge of the power supply wire, and wherein the protrusionhas a first thickness on the power supply wire and a second thicknessoutside the power supply wire, the second thickness larger than thefirst thickness.
 19. The organic light-emitting display apparatus ofclaim 18, further comprising thin-film transistors electrically coupledto the plurality of organic light-emitting devices, and wherein thepower supply wire and the plurality of organic light-emitting devicesare electrically coupled to each other through a wire.
 20. The organiclight-emitting display apparatus of claim 19, further comprising apassivation film between the thin-film transistors and the plurality oforganic light-emitting devices; and a pixel-defining film defining pixelregions of the plurality organic light-emitting devices, wherein theprotrusion comprises a same material as at least one selected from thepassivation film and the pixel-defining film.